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New concept of a high-speed low-power digital interface for multi-standard mobile transceiver RFIC's in 0.13 /spl mu/m CMOS

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5 Author(s)
Chabrak, K. ; Inst. for Electron. Eng., Erlangen-Nurnberg Univ., Erlangen ; Bachman, F. ; Hueber, G. ; Maurer, L.
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In this paper a new concept of a high-speed low power digital interface between the RF and the base-band chip of a multi-standard mobile phone is presented and compared to other popular interfaces. First, the requirements on a digital interface at the digital output of a multi-standard mobile phone RF front-end are explained. The paper gives an insight of popular digital interfaces and presents a new concept which is more robust against the ground bounce effect. We also show measurement results of a realized test chip that show functionality and benefits of the new concept

Published in:

Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2005. MAPE 2005. IEEE International Symposium on  (Volume:1 )

Date of Conference:

8-12 Aug. 2005