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Digital image correlation and its applications in electronics packaging

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4 Author(s)
Sun Yaofeng ; Singapore Inst. of Manuf. Technol. ; Tan Yeow Meng ; Pang, J.H.L. ; Su Fei

This paper provides a review of digital image correlation method for in-plane displacement measurements, as well as the variants of digital image correlation algorithms. After a broad literature review on digital image correlation, we found that it is clear that digital image correlation algorithms could be divided into two groups according to the image analysis performed in the spatial domain or the spectral domain. The state of the art in both groups is described and a comparison between them is demonstrated in the paper. Digital image correlation method, as one of experimental mechanics techniques, is broadly applied to research and engineering. As an example, digital image correlation applications for thermomechanical property characterization and thermomechanical reliability in electronics packaging are demonstrated and discussed

Published in:

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th  (Volume:1 )

Date of Conference:

7-9 Dec. 2005