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High density vertical probe card fabrication with low cost and high precision characteristics by using MEMS process

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5 Author(s)
Jung-Tang Huang ; Inst. of Mech. & Electr. Eng., Nat. Taipei Univ. of Technol. ; Chung-Yi Lin ; Wen-Shiung Lai ; Pen-Shan Chao
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The goal of this paper is mainly to develop an advanced MEMS probe card, which combines not only microelectroplating but CMP (chemical mechanical polishing) processes to manufacture a kind of spring-like probe. It is characterized by providing great deformation in its vertical axis (Y-axis). Apart from those specific technologies, finite element simulation software, COSMOS, is also employed to analyze the loading force distributed on the probe tip. Compared to the traditional drawing process, these MEMS based process is expected to have more flexible in probe design. Also, this process using batch mode fabrication method is also conducive to reduce the entire fabrication cost. We can reach the outstanding targets as following, hardness higher than HV 550, Young's modulus higher than 180 GPa, fatigue strength higher than 1 million times, maximum loading force about 4 g, and electric resistance less than 10 muOmega-cm

Published in:

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th  (Volume:1 )

Date of Conference:

7-9 Dec. 2005

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