By Topic

Task scheduling control of BGA solder joint process in flexible manufacturing system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Alonge, F. ; Dipt. di Ingegneria dell''Automazione e del Sistemi, Univ. of Palermo Viale delle Sci. ; D'Ippolito, F. ; Raimondi, F.M. ; Aiello, V.

This paper describes an open loop control method of the solder joint process in a rework station for faulty printed circuit board (PCBs) containing electronic components in packages ball grid arrays (BGAs). In particular, a mathematical model describing the solder joint process is, first of all, obtained. Then, the desired thermal profile of the junctions BGA-PCB is determined according to the physical constraints of the rework station framework. The control parameters corresponding to the above desired thermal profile are identified using the above mathematical model. Finally, the open loop control algorithm is implemented on the supervisor interface of the rework station in order to carried out experimental validation of the proposed method

Published in:

Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on  (Volume:2 )

Date of Conference:

19-22 Sept. 2005