Referenced Items are not available for this document.
We present a set of design tools for three dimensional (3D) mixed mode placement (MMP). The hierarchical 3D MMP design tool is composed of a hierarchical clustering package, a new 3D floorplanning tool, route planning tool, and 2D global/detailed placement tools. We have analyzed the performance of 3D circuit using these tools. It is shown that total wirelength could be reduced by 25% to 43% compared with traditional 2D design using two to four stacked dies. By incorporating thermal management and analysis, we also investigate the thermal scalability of 3D integration
Published in:
ASIC, 2005. ASICON 2005. 6th International Conference On
(Volume:2
)
Date of Conference: 24-0 Oct. 2005
- Page(s):
- 792 - 796
- Print ISBN:
- 0-7803-9210-8
- INSPEC Accession Number:
- 8967201
- Conference Location :
- Shanghai
- Digital Object Identifier :
- 10.1109/ICASIC.2005.1611447
- Product Type:
- Conference Publications
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