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Design tools for 3D mixed mode placement

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7 Author(s)
Zhuoyuan Li ; Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing ; Haixia Yan ; Xianlong Hong ; Qiang Zhou
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We present a set of design tools for three dimensional (3D) mixed mode placement (MMP). The hierarchical 3D MMP design tool is composed of a hierarchical clustering package, a new 3D floorplanning tool, route planning tool, and 2D global/detailed placement tools. We have analyzed the performance of 3D circuit using these tools. It is shown that total wirelength could be reduced by 25% to 43% compared with traditional 2D design using two to four stacked dies. By incorporating thermal management and analysis, we also investigate the thermal scalability of 3D integration

Published in:

ASIC, 2005. ASICON 2005. 6th International Conference On  (Volume:2 )

Date of Conference:

24-0 Oct. 2005