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Design of a high speed digital interface for multi-standard mobile transceiver RFICs in 0.13 μm CMOS

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7 Author(s)
Chabrak, K. ; Inst. for Electron. Eng., Erlangen Univ., Germany ; Bachmann, F. ; Hueber, G. ; Seemann, K.
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This paper presents the design of two different digital interfaces, both based on current signalling. First the requirements for a digital interface at the baseband output of a multi-standard mobile phone RF front-end are explained. The paper gives an insight of the popular digital interfaces and presents a new concept which is more robust against the ground bounce effect. At the end measurement results of a realized test chip are shown.

Published in:

Microwave Conference, 2005 European  (Volume:3 )

Date of Conference:

4-6 Oct. 2005