By Topic

MEMS-IC integration for RF and millimeterwave applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Dubuc, D. ; LAAS-CNRS, Toulouse, France ; De Raedt, W. ; Carchon, G. ; Do, M.N.
more authors

This paper reports on the MEMS-IC integration for microwave and millimeterwave applications. The integration is based on the system in package (SiP) approach achieving high performances and integration density level at microwave and millimeterwave frequencies thanks to the mixing of state-of-the-art technologies both for active (SiGe or RF-MOS technologies) and passive (dielectric based technology) devices/circuits. This concept can also take full benefit of the MEMS technologies to provide various smart functionalities to microsystem. The proposed approach is illustrated through different applications which outline the design issues of such heterogeneous microsystem.

Published in:

Microwave Conference, 2005 European  (Volume:3 )

Date of Conference:

4-6 Oct. 2005