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Practical finFET design considering GIDL for LSTP (low standby power) devices

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3 Author(s)
Tanaka, K. ; Syst. Devices Res. Labs., NEC Corp., Shimokuzawa ; Takeuchi, K. ; Hane, M.

Practical design of double-gate undoped-channel FinFET has been investigated through 3D device simulations considering gate-induced drain leakage (GIDL). Optimization of FinFET structure was carried out for hp45 low standby power (LSTP) device (Lg = 25nm). GIDL is reduced by using gradual and offset source/drain (S/D) profile while degradation of drive current is minimized. Through the optimization of lateral spread and offset of S/D profile, the ITRS specifications for drive current and off-state leakage current are achievable by FinFET with 10nm fin width

Published in:
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International

Date of Conference: 5-5 Dec. 2005

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