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Compact modeling and fast simulation of on-chip interconnect lines

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4 Author(s)
Ioan, D. ; Electr. Eng. Dept., Bucharest Univ. ; Ciuprina, G. ; Radulescu, M. ; Seebacher, E.

An efficient methodology to extract compact models for microstrip lines on lossy silicon substrate is presented. The transversal magnetic field equations are solved by dual finite integration technique (dFIT), a numerical method which allows the accuracy control of the computed frequency dependent line parameters. Several techniques are used to accelerate the process of p.u.l. parameters extraction, such as minimal virtual boundary, minimal mesh and minimal frequency samples set. The solution of the transmission line equations with frequency dependent parameters is then approximated by a rational function of appropriate degree in order to extract the compact model and its SPICE equivalent circuit. The behavior of the obtained compact model of order 10 shows good agreement with respect to the measured data

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Magnetics, IEEE Transactions on  (Volume:42 ,  Issue: 4 )