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Single chip RF front-end MMIC solutions for future low cost, miniature size, WLAN transceiver module applications

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5 Author(s)
Yuen, C. ; Epic Commun., Inc., Sunnyvale, CA, USA ; Laursen, K. ; Adams, M. ; Due Chu
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Several highly integrated RF front-end modules (FEMs) for 802.11 b/g and a/b/g applications are described. In a single 4×4 mm or 5×5 mm QFN package, these FEMs include linearized power amplifier(s), a low-noise amplifier, T/R diversity switch, filters, diplexers, power detectors, and all biasing and matching circuitry. The RF FEMs replace over 30 discrete and IC components with a single package, and require practically no external components. They have the smallest footprint of any 802.11 FEM on the market and allow significant cost savings at the system level by reducing parts count, simplifying assembly, and increasing yield.

Published in:

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings  (Volume:5 )

Date of Conference:

4-7 Dec. 2005