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UWB chip antenna design using LTCC multilayer technology for mobile applications

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3 Author(s)
Chun-Yih Wu ; Comput. & Commun. & Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan ; Chia-Lun Tang ; An-Chia Chen

A compact surface-mount ultra-wideband (UWB) chip antenna fabricated using multilayer low-temperature co-fired ceramic (LTCC) technology is presented. The antenna, suitable for mobile applications, is of a two layered metal-plate structure and occupies a compact size of 14 × 10 × 1.5 mm3 only. With a very wide operating bandwidth of about 4.98 GHz, the antenna can cover the lower band of DS-UWB (3.1-4.85 GHz). The antenna radiation patterns at 4.0 GHz and the antenna gain are also measured and discussed.

Published in:
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings  (Volume:3 )

Date of Conference: 4-7 Dec. 2005

Print ISBN:
0-7803-9433-X
INSPEC Accession Number:
8857214
Digital Object Identifier :
10.1109/APMC.2005.1606570
Product Type:
Conference Publications

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