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Capacitance extraction of high-density 3D interconnects using finite element method

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3 Author(s)
Jianfeng Xu ; Sch. of Electron. & Electr. Eng., Shanghai Jiao Tong Univ., China ; Wen-Yan Yin ; Junfa Mao

In this paper, the element-by-element technique in conjunction with preconditioned conjugate gradient (PCG) solver is adopted for fast parameter extraction of multi-layer and multi-conductor interconnects in VLSI circuit. In order to partially implement parallel computation, the proposed technique takes advantage of Fortran 95 in the array manipulation, and the efficiency of this technique is verified by numerical examples. Compared to some reference solutions, both the memory requirement and the CPU time are significantly reduced while maintaining a relatively high accuracy.

Published in:

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings  (Volume:2 )

Date of Conference:

4-7 Dec. 2005

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