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Development of Au reflection film with high adhesion for high-density optical interconnection between LSI chips

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6 Author(s)
Yokota, K. ; Ubiquitous Syst. Res. Center, Fujitsu Labs. Ltd., Akashi, Japan ; Satoh, R. ; Iwata, Y. ; Fujimoto, K.
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We have developed a new multilayered reflection film structure containing Au for achieving slab waveguide based optical transmission interconnections between large-scale integration chips for next-generation high speed computers. The noble metals, especially Au, have outstanding characteristic as a high reflection film in a slab waveguide. However, when these metals are combined with optically transparent films of a SiO/sub 2/ system, there are severe problems with poor adhesion and poor thermal stability. In this work, we have solved these problems by inserting Cr films above and below the Au film resulting in the development of a new multilayered reflection film structure with superior reflectivity and adhesion characteristics.

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Components and Packaging Technologies, IEEE Transactions on  (Volume:29 ,  Issue: 1 )