By Topic

Effect of the inlet location on the performance of parallel-channel cold-plate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ming-Chang Lu ; Energy & Resources Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan ; Chi-Chuan Wang

This study numerically examines the influence of inlet locations on the performance of the Multichannel cold-plates. A total of five inlet configurations (namely I-, Z-, ]-, L-, and /spl Gamma/-arrangement) are investigated in this study. The velocity maldistribution and nonuniformity of temperature field caused by the fluid flow are shown in the simulation. For I-arrangement, higher inlet flow rate of the cold-plate shows more considerable maldistribution, and this maldistribution is decreased when the number of channels of the cold-plate is increased. The Z-arrangement and L-arrangements show a pronounced flow-recirculation that eventually leads to a much larger temperature difference along the surface of the cold-plate. Conversely, there is no flow recirculation in the ]-arrangement and a comparatively uniform flow distribution is seen. For the same average inlet velocity, I-arrangement has the highest pressure drop whereas ]-arrangement shows the lowest pressure drop. The I- and /spl Gamma/-arrangement give the best heat transfer performance due to their impingement configurations whereas the Z-arrangement shows the lowest heat transfer performance for its dramatic flow recirculation and maldistribution.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:29 ,  Issue: 1 )