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This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.