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60-GHz-band LTCC module technology for wireless gigabit transceiver applications

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4 Author(s)
Maruhashi, K. ; Syst. Devices Res. Lab., NEC Corp., Shiga, Japan ; Ito, M. ; Kishimoto, S. ; Ohata, K.

This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.

Published in:

Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on

Date of Conference:

30 Nov.-2 Dec. 2005