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3D measurement of thermal deformations on an ultra-high density circuit moduled with a laser range probe

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3 Author(s)
Gloeckner, P.J. ; Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA ; Kokini, K. ; Stevenson, Warren H.

A laser triangulation range sensor mounted on a coordinate measuring machine was used to measure thermally induced deformations in a circuit module. The module was housed in an environmental test chamber with optical access for the laser probe, and measurements were made over a 25-125°C range with an estimated accuracy of ±5 μm. The results clearly show relative 3D displacements of circuit module components which could cause failure of the module under thermal stress

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 4 )