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A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling

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5 Author(s)
J. Huang ; Univ. of Sci. & Technol., Beijing, China ; H. Y. Lai ; Y. Y. Qian ; Y. H. Jiang
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A damage model of low cycle shear fatigue has been developed in dislocation theory. On the basis of this model, a formula including the factors of thermal cycle temperature, dwell time, and atmospheric oxidation has been established to predict the life of surface mount technology (SMT) solder joints under thermal cycling. This formula has been verified by experiments on the specimens of actual SMT assemblies. The results show that the life formula established coincides with the experimental results

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:15 ,  Issue: 4 )