Cart (Loading....) | Create Account
Close category search window
 

Time-domain characterization of interconnect discontinuities in high-speed circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Jyh-Ming Jong ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; Tripathi, V.K.

Experimental techniques to characterize typical interconnect discontinuities such as bends and steps, based on time-domain reflection (TDR) measurements, are formulated. These interconnect discontinuities are characterized in terms of general lumped/distributed circuit models which are compatible with CAD simulation tools such as SPICE. The results for the model element values are shown to be consistent with frequency-domain lumped equivalent models for microstrips derived from S-parameter measurements and electromagnetic computations based on the excess inductance and capacitance concepts. The models are also validated by simulating their step response on SPICE and comparing them with the TDR data

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 4 )

Date of Publication:

Aug 1992

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.