A novel multichip module assembly approach using gold ball flip-chip bonding

A multichip module (MCM) approach that dramatically reduces the circuit area of a portable communications transceiver is described. The MCM incorporated a 1-in square (2.54-cm square) silicon substrate fabricated with thin-film resistors and a double-metal linear process technology. The die bonding was performed with a flip-chip process that uses unmodified, off-the-shelf ICs. The process is performed using standard wirebonding equipment and a thermocompression flip-chip bond. The resulting MCM reduced the required circuit board area by 40%.<
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