Referenced Items are not available for this document.
The ES/9000 models 820 and 900 high-performance mainframe processors have been significantly enhanced with respect to their predecessors, due to the following packaging advances: multilayer glass-ceramic/copper cofired substrate; multilayer polyimide/copper thin-film structure; discrete decoupling capacitors; buried engineering change conductors; enhanced pistons for very high thermal conduction cooling; and enhanced flip-chip solder connections. Some aspects of these advances are examined. The connectors and printed wiring board technologies used in this family of systems are summarized
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:15
,
Issue:
4
)
Date of Publication: Aug 1992
- Page(s):
- 426 - 431
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 4288297
- Digital Object Identifier :
- 10.1109/33.159869
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Aug 1992
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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