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Flip chip ball grid array (FCBGA) has been a common package technology to achieve higher input/output (IO) count. The call for more features have increase the input/output (I/O) interface density and require a better power delivery solution which translate into bigger form factor and more expensive decoupling solution. Increasing the package and die size is not an option as it increases the package cost. This paper focuses on the innovation and three design solutions provided to meet the demand for higher IO and power requirement. All the three solutions are discussed in details in this paper.
Date of Conference: 11-14 Dec. 2005