Cart (Loading....) | Create Account
Close category search window
 

Wafer-scale BCB resist-processing technologies for high density integration and electronic packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Pelzer, R. ; EV Group, Schaerding, Austria ; Dragoi, V. ; Swinnen, B. ; Soussan, P.
more authors

IC performance is drastically limited by line-to-line capacity coupling and RC interconnect delay times resulted from the continuous increase in integration densities with 0.10μm line and space width approaches, as well from increased signal frequencies. The new achievements in terms of circuit lines shrinkage emphasize the need for the introduction of Cu and low-k dielectric materials The main properties of the dielectric materials required for a large field of versatile applications/designs can be summarized in: isotropic dielectric constants (2.65-2.5@ 1MHz-10GHz), good thermal stability, low CTE and a good adhesion to different substrates. Commercially available benzocyclobutene (BCB)-based polymer dielectrics, like cyclotone from Dow Chemical Company can fulfil these demands. The new materials not only opened new application areas, but also penetrated well established technologies. The extensive field of BCB-based applications ranges from interlayer dielectric applications - chip stacking by vertical 3D interconnections, to pad redistribution layers and device encapsulation. These technologies realized in vertical interconnection and wafer-level packaging (WLP), are viable solutions for increasing electronic device functional density and reducing total packaging costs. This paper reports on different BCB applications for wafer-to-wafer adhesive bonding for 3D integration, sprays coating for encapsulation and photo-structuring using a proximity mask aligner for pad redistribution and integrated passives.

Published in:

Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on

Date of Conference:

11-14 Dec. 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.