Cart (Loading....) | Create Account
Close category search window

Studies on double-layered metal bumps for fine pitch flip chip applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Ho-Young Son ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Yong-Woon Yeo ; Gi-Jo Jung ; Jun-Kyu Lee
more authors

In this paper, Cu/SnAg double-layered bumps structure was proposed and investigated for the fine pitch flip chip applications. Test chip was designed considering the recent high speed memory device and its pad size and pitch was 60μm and 100μm, respectively. Cu and SnAg bumps were fabricated as a 60μm and 20μm thickness on SiO2/Ti/TiN/Al/TiW/Cu on Si wafer using the electroplating method. Test chip was flip chip assembled with PCB substrates using thermo-compression bonding method. Because the pitch was very tight, the flip chip bonding of Cu/SnAg double bumps was very difficult and it affected several bonding parameters such as bonding pressure, temperature, time, Cu bump diameter and so on. The bonding results were evaluated through the cross-sectional image of interconnection and the electrical continuity test of daisy chain and bump resistance using 4-point Kelvin structure. The long time reliability tests like thermal cycling test and 85°C/85% test are now in progress after flip chip bonding and underfill dispensing.

Published in:

Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on

Date of Conference:

11-14 Dec. 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.