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Reliability assessments of BGA solder joints under cyclic bending loads

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2 Author(s)
Ilho Kim ; Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Soon-Bok Lee

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder.

Published in:

2005 International Symposium on Electronics Materials and Packaging

Date of Conference:

11-14 Dec. 2005