By Topic

Low-cost epoxy packaging of CMOS Hall-effect compasses

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

For the first time, a compass using CMOS Hall-sensors in a low-cost epoxy package is presented. Due to the high mechanical stress sensitivity of CMOS Hall-sensors, such low-cost plastic or epoxy mold packages have not been a viable option for low-offset applications like the compass application. Instead, expensive ceramic packages have been used. A recently developed, stress insensitive, CMOS Hall-sensor, shows only a 1.65muT offset shift after epoxy molding, while maintaining its low 3muT (3a) offset spread. After repeated thermal shock, the Hall sensor's offset returns almost completely to its original value. For the compass application, the two horizontal plane components of the earth's magnetic field have to be measured. So a package with two orthogonally aligned Hall-sensors was developed

Published in:

Sensors, 2005 IEEE

Date of Conference:

Oct. 30 2005-Nov. 3 2005