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The evolution of the CdTe detector properties (leakage current, capacitance, and geometry) requires a continuous improvement of the electronic frond-end in terms of geometry, noise, and power consumption. This is why our group is working on a new modular spectro-imaging system based on CdTe detectors coupled to dedicated full custom readout ASICs, named IDeF-X for imaging detector front-end. We present the most recent version of IDeF-X which is a sixteen-channel analogue readout chip for hard X-ray spectroscopy. It has been processed with the standard AMS 0.35 μm CMOS technology. Each channel consists of a charge sensitive preamplifier, a pole zero cancellation stage, a variable peaking time filter and an output buffer. IDeF-X is designed to be DC coupled to detectors having a low dark current at room temperature and is optimized for input capacitance ranging from 2 to 5 pF.