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We developed a method for the uniform electrodeposition of organic dielectric on gold electrodes after the release process in MEMS device fabrication. The method involves dipping in HClaq and HClaq as pre-treatment and an optimized annealing temperature as post-treatment. The method proved its effectiveness on the gold comb-shaped electrodes in vibrational MEMS devices.
Date of Conference: 25-28 Oct. 2005