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Electrodeposition of organic dielectric and its application to MEMS devices

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6 Author(s)
Sakata, T. ; NTT Microsyst. Integration Labs., Atsugi, Japan ; Ishii, H. ; Okabe, Y. ; Sato, N.
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We developed a method for the uniform electrodeposition of organic dielectric on gold electrodes after the release process in MEMS device fabrication. The method involves dipping in HClaq and HClaq as pre-treatment and an optimized annealing temperature as post-treatment. The method proved its effectiveness on the gold comb-shaped electrodes in vibrational MEMS devices.

Published in:

Microprocesses and Nanotechnology Conference, 2005 International

Date of Conference:

25-28 Oct. 2005