Progress in ArF immersion lithography

193nm immersion lithography has recently gained a lot of momentum, and is currently anticipated to be the prime lithography solution for the 65nm and 45nm half pitch technology nodes. In this paper, the latest achievements obtained in the IMEC immersion program are reviewed. Also the remaining concerns are addressed. Items touched upon are: lithographic performance of the full field scanner, defectivity including bubbles, resist and top coat progress and polarization effects.