By Topic

Mathematically assisted adaptive body bias (ABB) for temperature compensation in gigascale LSI systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Kumar, S.V. ; Dept. of Electr. & Comput. Eng., Minnesota Univ. ; Kim, C.H. ; Sapatnekar, S.S.

Process variations and temperature variations can cause both the frequency and the leakage of the chip to vary significantly from their expected values, thereby decreasing the yield. Adaptive body bias (ABB) can be used to pull back the chip to the nominal operational region. We propose the use of this technique to counter temperature variations along with process variations. We present a CAD perspective for achieving process and temperature compensation using bidirectional ABB. Mathematical models are used to determine the exact amount of body bias required optimizing the delay and leakage, and an algorithmic flow that can be adopted for gigascale LSI systems is provided

Published in:

Design Automation, 2006. Asia and South Pacific Conference on

Date of Conference:

24-27 Jan. 2006