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Passively assembled optical interconnection system based on an optical printed-circuit board

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8 Author(s)
Sung Hwan Hwang ; Opt. Interconnection & Switching Lab., Inf. & Commun. Univ., Daejeon, South Korea ; Mu Hee Cho ; Sae-Kyoung Kang ; Hyo-Hoon Park
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We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver modules, and 90°-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.

Published in:

IEEE Photonics Technology Letters  (Volume:18 ,  Issue: 5 )