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A new internal triple-band planar inverted-F antenna (PIFA) is presented. It is implemented by printing radiating conductors over both sides of an FR4 board. The geometrical parameters and electrical performances of the antenna can be obtained by cutting embedded slots on the patch surfaces and realizing electric via holes between two layers of the patch. This antenna covers GSM (880Â¿960 MHz), DCS (1710Â¿1880 MHz), and Bluetooth (2400Â¿2484 MHz) bands. Features of each band can be easily optimized by tuning the position, shape, and size of the embedded slots and via holes in the radiating patch. The experimental results of the proposed antenna are discussed and compared with simulation results from the available simulator to validate our proposed antenna design.