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LTCC technology for system in package solutions

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5 Author(s)

There is a continuous trend to modularization since information, communication, data processing and automotive industries ask for integration of active and passive devices and further miniaturization. This paper shows how EPCOS, one of the leading component manufacturers is serving the needs of the industries by making use of their advanced LTCC (low temperature cofired ceramics) technology, extensive design, and assembly know-how. It will be explained how active and passive components can be embedded and matched to get smallest packages, easy to use, robust, and reliable devices

Published in:

Silicon Monolithic Integrated Circuits in RF Systems, 2006. Digest of Papers. 2006 Topical Meeting on

Date of Conference:

18-20 Jan. 2006

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