By Topic

LTCC technology for system in package solutions

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)

There is a continuous trend to modularization since information, communication, data processing and automotive industries ask for integration of active and passive devices and further miniaturization. This paper shows how EPCOS, one of the leading component manufacturers is serving the needs of the industries by making use of their advanced LTCC (low temperature cofired ceramics) technology, extensive design, and assembly know-how. It will be explained how active and passive components can be embedded and matched to get smallest packages, easy to use, robust, and reliable devices

Published in:

Silicon Monolithic Integrated Circuits in RF Systems, 2006. Digest of Papers. 2006 Topical Meeting on

Date of Conference:

18-20 Jan. 2006