Summary form only given. Ultrathin gate oxides prepared by rapid thermal oxidation of Si in pure N2O exhibit superior resistance to dopant penetration and electrical stressing as compared to pure SiO2. The improved performance and excellent reliability (on- and off-state) of both n- and p-MOSFETs with ultrathin (~60-Å) gate oxides were prepared by conventional furnace oxidation of Si in N2O. The results suggest that the N2 O oxide is a promising candidate for ultrathin gate dielectric technology for CMOS ULSI applications
Published in:
Electron Devices, IEEE Transactions on
(Volume:38
,
Issue:
12
)
Date of Publication: Dec 1991