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Understanding IC lithography

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1 Author(s)
Ziger, D.H. ; AT&T Bell Lab., Allentown, PA, USA

Factors such as minimum resolution overlay tolerances and maximum topography are key elements of IC fabrication. Circuit designers must understand the techniques lithographers use in manufacturing ICs. An overview of the resist work performed at SEMATECH, including resist characterization, process control, and modeling, and a look at future lithography trends are presented. Swing curve, exposure/focus latitude, contrast, reflective notching, development rate, and plasma and thermal resistance measurement procedures for performing resist evaluations are discussed.<>

Published in:
Circuits and Devices Magazine, IEEE  (Volume:8 ,  Issue: 5 )

Date of Publication: Sept. 1992

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