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A fully packaged 4×4 integrated optical switch matrix

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3 Author(s)
Varrazza, R. ; Dept. of Electr. & Electron. Eng., Univ. of Bristol, UK ; Bricheno, T. ; Siyuan Yu

This paper describes a packaged and fiber array coupled 4×4 optical crosspoint switch designed for optical packet switching. Alignment and fixation techniques of two perpendicular fiber arrays to the integrated InP-based switch chip have been developed. Thermal management is also included in the packaging. The packaged devices demonstrate long-term stability and have been used in switch modules, including the packaged device and electronic interfaces.

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Selected Topics in Quantum Electronics, IEEE Journal of  (Volume:11 ,  Issue: 6 )