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Modeling of Heat Spreaders for Cooling Power and Mobile Electronic Devices

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7 Author(s)
Angelov, G. ; Dept. of Microelectronics, Tech. Univ. of Sofia ; Tzanova, S. ; Avenas, Y. ; Ivanova, M.
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The paper addresses theoretical and modeling issues of micro heat pipes with parallelepipedal shape with regard to the capillary limit and the evaporator boiling limit. In particular, the well-established Faghri model is employed to simulate the heat transfer capability of selected heat pipes developed and tested at the Laboratory of Electrotechnique of Grenoble. An improved model is suggested and it is compared with the simulation and experimental results. The improved model implements a different analytically derived form of the friction factor-Reynolds number product in the Faghri model. The simulated results with the proposed model demonstrate better coherence to the experiment showing the importance of accurate physical modeling to heat conduction behavior of the heat spreader

Published in:

Power Electronics Specialists Conference, 2005. PESC '05. IEEE 36th

Date of Conference:

16-16 June 2005