By Topic

De-embedding transmission line measurements for accurate modeling of IC designs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Mangan, A.M. ; Quake Technol. Inc., Ottawa, Ont., Canada ; Voinigescu, S.P. ; Ming-Ta Yang ; Tazlauanu, M.

A new technique to de-embed the contributions of parasitic structures from transmission line measurements is presented and applied to microstrip lines fabricated in 90- and 130-nm RF-CMOS technologies. De-embedded measurements are used to extract characteristic impedance, attenuation constant, group delay, and effective permittivity. The effective thickness of the ground plane is demonstrated to be as important as the thickness of the top metal layer in minimizing interconnect loss. Furthermore, it is confirmed that metal area densities as low as 65% are adequate for the ground plane of microstrip lines.

Published in:

Electron Devices, IEEE Transactions on  (Volume:53 ,  Issue: 2 )