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Browse Journals & Magazines > Circuits and Devices Magazine ...> Volume:21 Issue:6 Help

Thermal imaging bundle - A potential tool to enhance minimally invasive medical procedures

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1 Author(s)
Gannot, Israel

First Page of the Article

Published in:
Circuits and Devices Magazine, IEEE  (Volume:21 ,  Issue: 6 )

Date of Publication: Jan.-Feb. 2006

Page(s):
28 - 33
ISSN :
8755-3996
Digital Object Identifier :
10.1109/MCD.2005.1578585
Product Type:
Journals & Magazines
Date of Current Version :
23 January 2006
Issue Date :
Jan.-Feb. 2006
Sponsored by :
IEEE Circuits and Systems Society

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