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Experiment study of temperature parameter effect on bonding process and quality in thermosonic wire bonding

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4 Author(s)
Long Zhili ; Coll. of Electromech. Eng., Central South Univ., Changsha, China ; Han Lei ; Wu Yunxin ; Zhong Jue

An experiment study of temperature parameter on bonding process and bonding quality in thermosonic wire bonding was performed in this paper. The experiment method was based on changing regularly bonding temperature and gaining the bonding strength by shearing gold ball joint by a high precision gauge. The experiment results and analysis can find out the relationship of bonding temperature and bonding strength, and get the temperature ultimate, favorite temperature window and bondability window at that bonding condition. Moreover, the experiment can find that the effect of temperature on impedance and power of PZT transducer in bonding process. These experiment phenomena and analysis results can be help to research on bonding parameters matching and optimization in thermosonic wire bonding.

Published in:

Electronic Packaging Technology, 2005 6th International Conference on

Date of Conference:

30 Aug.-2 Sept. 2005