Referenced Items are not available for this document.
With the scaling of CMOS, the system-on-chip (SOC) has become a viable option for RF system. The absence of high Q inductors for CMOS RF has led to an appearance of RF system-in-package. In this paper, we analyze the merit of the package for CMOS RF IC and review development of the package. We focus on LTCC technology and simulate a high performance mixer using stacked spiral inductor.
Published in:
Electronic Packaging Technology, 2005 6th International Conference on
Date of Conference: 30 Aug.-2 Sept. 2005
- Page(s):
- 102 - 104
- Print ISBN:
- 0-7803-9449-6
- INSPEC Accession Number:
- 8788908
- Digital Object Identifier :
- 10.1109/ICEPT.2005.1564640
- Product Type:
- Conference Publications
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