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Design and simulation of SIP for RF system

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4 Author(s)
Liu Lin-tao ; Microelectron. Center, Harbin Inst. of Technol., China ; Yu Ming-yan ; Ye Yi-zheng ; Wang Jin-xiang

With the scaling of CMOS, the system-on-chip (SOC) has become a viable option for RF system. The absence of high Q inductors for CMOS RF has led to an appearance of RF system-in-package. In this paper, we analyze the merit of the package for CMOS RF IC and review development of the package. We focus on LTCC technology and simulate a high performance mixer using stacked spiral inductor.

Published in:

Electronic Packaging Technology, 2005 6th International Conference on

Date of Conference:

30 Aug.-2 Sept. 2005

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