A high-speed three-dimensional (3-D) graphics SoC for consumer applications is presented. A 166-MHz 3-D graphics full pipeline engine with performance of 33 Mvertices/s and 1.3Gtexels/s, and 333-MHz ARM11 RISC processor, and video composition IPs are integrated together on a single chip. The geometry part of 3-D graphics IP provides full programmability in vertex and triangle level, and two-level multi-texturing with trilinear MIPMAP filtering are realized in the rasterization part. Per-pixel effects such as fog effects, alpha blending, and stencil test are also implemented in the proposed 3-D graphics IP. The rasterization architecture is designed for reducing external memory accesses to achieve the peak performance. The chip is fabricated using 0.13μm CMOS technology and its area is 7.1×7.0mm2.
Published in:
Solid-State Circuits, IEEE Journal of
(Volume:41
,
Issue:
1
)
Date of Publication: Jan. 2006