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An SoC with 1.3 gtexels/s 3-D graphics full pipeline for consumer applications

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16 Author(s)
Donghyun Kim ; Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Kyusik Chung ; Chang-Hyo Yu ; Chun-Ho Kim
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A high-speed three-dimensional (3-D) graphics SoC for consumer applications is presented. A 166-MHz 3-D graphics full pipeline engine with performance of 33 Mvertices/s and 1.3Gtexels/s, and 333-MHz ARM11 RISC processor, and video composition IPs are integrated together on a single chip. The geometry part of 3-D graphics IP provides full programmability in vertex and triangle level, and two-level multi-texturing with trilinear MIPMAP filtering are realized in the rasterization part. Per-pixel effects such as fog effects, alpha blending, and stencil test are also implemented in the proposed 3-D graphics IP. The rasterization architecture is designed for reducing external memory accesses to achieve the peak performance. The chip is fabricated using 0.13μm CMOS technology and its area is 7.1×7.0mm2.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:41 ,  Issue: 1 )