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A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

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5 Author(s)
Miura, N. ; Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan ; Mizoguchi, D. ; Inoue, M. ; Sakurai, T.
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A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-μm pitch in 0.25-μm CMOS technology. By thinning chip thickness to 10μm, the interface communicates at distance of 15 μm at minimum and 43 μm at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:41 ,  Issue: 1 )