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Subterranean photonics using SIMOX 3-D sculpting for optoelectronic integration in silicon-on-insulator

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3 Author(s)
Indukuri, T. ; Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA ; Koonath, P. ; Jalali, B.

Three-dimensional optoelectronic integration can be achieved in SOI wafers using the process of SIMOX 3D sculpting. Micro-resonators, with unloaded Q of 8000 and extinction ratio >20 dB, were fabricated in a buried silicon layer and MOS transistor structures were fabricated on the surface silicon layer using a patterned SIMOX process.

Published in:

SOI Conference, 2005. Proceedings. 2005 IEEE International

Date of Conference:

3-6 Oct. 2005