By Topic

CMOS photonics™ - SOI learns a new trick

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Gunn, C. ; Luxtera, Inc., Carlsbad, CA, USA

Luxtera has used Freescale Semiconductor's production 0.13μm SOI process to implement optical communications capability for high bandwidth LAN, SAN, shelf-to-shelf and chip-to-chip communications. These optical transceiver cores operate at 10Gbps and offer superior reach, power consumption, latency, die area, and scalability compared to emerging standards for electrical interconnect. They are monolithically fabricated alongside SOI CMOS circuitry in the same die. Thus, for the first time in history, high speed optical communications directly between silicon die can be accomplished at a price/performance point superior to traditional electrical interconnect.

Published in:

SOI Conference, 2005. Proceedings. 2005 IEEE International

Date of Conference:

3-6 Oct. 2005