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Low-stress permalloy for magnetic MEMS switches

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5 Author(s)
Yonghua Zhang ; Inst. of Micro & Nano Sci. & Technol., Shanghai Jiaotong Univ., China ; Guifu Ding ; Hong Wang ; Shi Fu
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The residual stress in the electroplated magnetic films is an important factor that limits the functionality of many micromagnetic devices. We have investigated the stress in electroplated Ni-Fe alloy for MEMS as a function of bath concentration, utilizing the wafer-bending method. Our investigation demonstrated that a low-concentration plating solution decreases the residual stress in the electrodeposits, and the stress is further decreased by increasing the saccharin additive content. We obtained the low-stress Permalloy Ni81Fe19 in our experimental conditions. We fabricated a bistable electromagnetic RF MEMS switch with deformation-free cantilever beam using the electroplated Permalloy.

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Magnetics, IEEE Transactions on  (Volume:42 ,  Issue: 1 )