By Topic

An investigation of bonding-layer characteristics of substrate-bonded fiber Bragg grating

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Chih-Chun Cheng ; Dept. of Mech. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan ; Yu-Lung Lo ; B. S. Pun ; Y. M. Chang
more authors

An analytic model of a bonding layer for a fiber Bragg grating (FBG) bonded on a substrate was developed to predict the strain transfer from the substrate to the FBG when the substrate is subjected to external forces. This model provides a guide on how to bond an FBG on a substrate as a strain sensor or as a chirp FBG spectrum-tuning device used in telecommunications. In addition, an inverse approach based on an optimization technique was developed to investigate which part of the strain distribution along the FBG causes sidebands and ripples when an FBG is stretched to become a chirped FBG (CFBG) using the substrate-straining technique. Results show that the primary influence of an unacceptable bonding layer on the strain transfer from the substrate to the FBG is near the two ends of the FBG, which causes sidebands in the reflective spectrum. Using a glue with a high shear modulus, we can increase the bonding length and reduce the bonding-layer thickness to effectively improve the strain transmissibility of the bonding layer. However, if the strain transfer from the substrate to the FBG exhibits fluctuations due to an improper bonding process or a deteriorating bonding layer, ripples occur in the corresponding wavelength spectra. The number and amplitude of the ripples correlate strongly to those of strain fluctuations in the FBG.

Published in:

Journal of Lightwave Technology  (Volume:23 ,  Issue: 11 )