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The specific properties and structure of new chemically metallized polyimides films were investigated by RSA, DSK, TGA methods and by measurements of the microhardness and the electrical conductivity. The surface layers represent composite material in which metal nanoparticles strengthen the polymer. The method of microhardness can be used as express-method for estimation the depth of metal particle penetration. The value of the electrical conductivity permits to estimate the thickness of "high conductivity" owing to impurities after chemical modification. The high adhesion, caused by the specific structure, makes these films prospective for new techniques.