Cart (Loading....) | Create Account
Close category search window
 

Design and process considerations for fabricating RF MEMS switches on printed circuit boards

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Hung-Pin Chang ; Dept. of Mater. Sci. & Eng., Univ. of California, Irvine, CA, USA ; Jiangyuan Qian ; Cetiner, B.A. ; De Flaviis, F.
more authors

Design considerations and process development for fabricating radio frequency microelectromechanical systems (RF MEMS) switches on microwave laminate printed circuit boards (PCBs) are presented in details in this work. Two key processes, high-density inductively coupled plasma chemical vapor deposition (HDICP CVD) for low-temperature silicon nitride deposition, and compressive molding planarization (COMP) have been developed for fabricating RF MEMS switches on PCB. The effects of process conditions of HDICP CVD on low-temperature nitride film are fully characterized for its use in RF MEMS switches on PCB. Not only can COMP planarize the surface of the photoresist for lithographic patterning over topologically complex surfaces, but also simultaneously create a membrane relief pattern on the surface of a MEMS structure. Several membrane-type capacitive switches have been fabricated showing excellent RF performance and dynamic responses similar to those on semiconductor substrates. This technology promises the potential of enabling further monolithic integration of switches with other RF components, such as antennas, microwave monolithic integrated circuits (MMICs), phase shifters, tunable filters, and transmission lines on the same PCBs reducing the losses due to impedance mismatching from components/system assembly and simplifies the design of the whole RF system. [1416].

Published in:

Microelectromechanical Systems, Journal of  (Volume:14 ,  Issue: 6 )

Date of Publication:

Dec. 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.