Cart (Loading....) | Create Account
Close category search window

Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Cherault, N. ; Centre des Materiaux, Ecole des Mines de Paris, Evry, France ; Besson, J. ; Goldberg, C. ; Casanova, N.
more authors

The integration of low-k interlayer dielectrics in interconnects is associated with an increase in mechanical reliability risks. Thermomechanical stresses must be evaluated to understand the behavior of interconnects. As manufacturing processes can introduce large stresses, a sequential process modeling technique is developed in this study. The constituent materials of the interconnects are described by a single elasto-plastic constitutive equation developed from substrate curvature measurements. Stresses in Cu/low-k lines are also evaluated. A good correlation between finite element modeling and curvature measurements is obtained.

Published in:

Solid-State Device Research Conference, 2005. ESSDERC 2005. Proceedings of 35th European

Date of Conference:

12-16 Sept. 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.